Enhanced X-Ray (also known as Planar CT)
It is a high-speed in-line 3D X-ray tomography inspection system specially developed for thin flat workpieces. It upgrades traditional 2D planar imaging to precise 3D slicing inspection. Targeting thin flat components including lithium battery electrodes, PCBs, PCBA assembled mainboards, semiconductor packages and more, it addresses the core drawback of overlapping internal features in conventional 2D X-ray. The system delivers layered penetration visualization of internal structures at high throughput, ideal for real-time non-destructive testing on mass-production lines.
Core Advantages
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Eliminate Occlusion Interference of Components
Conventional 2D X-ray superimposes top-layer chips and bottom-layer solder joints in a single frame, concealing solder joint defects. Enhanced X-Ray performs layered slicing to independently inspect BGA voids, hidden cold solder joints and inner vias without visual occlusion.
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Compatible with High-Speed Mass Production Lines
Rapid multi-angle data acquisition paired with real-time image reconstruction delivers throughput matching SMT assembly lines, making it the mainstream core solution for in-line 3D Automated X-ray Inspection (AXI) equipment.
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High Precision Detection of Micro Defects
Imaging precision ranges from 4 to 10 microns, enabling identification of tiny solder voids, microcracks, and flaws in buried/blind vias for semiconductors.
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Support for Large-Size Panels
Capable of scanning full large-format boards (max. approx. 750×530 mm), a capability unachievable by rotary cone-beam CT limited by stage footprint constraints.
Primary Application Scenarios
1. Electronics Manufacturing (Most Widely Adopted)
- Lithium Battery Inspection: Tab welding cracks, tab wrinkling, internal electrode misalignment
- SMT Assembled Mainboards: Inspection of void ratio in BGA/QFN solder balls, cold solder, insufficient solder, and hidden lead defects
- Semiconductor Devices: IGBT power modules, chip packaging, micro-substrates, Through-Glass Via (TGV) inspection
2. Quality Inspection Functions
- Automatic calculation of solder ball void percentage
- Layer-by-layer cross-section viewing of multi-layer circuit boards
- Accurate depth positioning of defects, resolving the limitation of 2D X-ray that cannot identify which layer contains defects
- Automatic pass/fail judgment for products on production lines
In-Line Inspection for Bare Cell & Finished Cell Enhanced X-Ray
- Electrode Overhang
- Electrode wrinkling, electrode flanging, electrode fracture
- Angular and dimensional measurement of cell electrodes
- Slag inspection
Inspection precision: 7 μm per pixel
Equipment Features
- Vertical linear magnetic levitation module for flexible and high-efficiency motion
- Custom moving-actuator carrier compatible with cell testing of various dimensions
- High-precision CCD vision system working synchronously with robots for real-time posture adjustment
- Integrated in-line OCV testing to realize multi-functionality on a single machine
- Three parallel X-Ray testing groups delivering a throughput of 60 parts per minute (60 ppm)
- Real-time analysis of inspection data for efficient product sorting
- Heavy-shielded lead enclosure with contoured tunnel design to effectively block radiation and protect operators from radiation hazards
