This machine automatically weld the battery terminals with ultra-high precision.
It features:
Tray feeding, automatic scanning, tape pasting, rolling pressing, laser cutting, hot pressing, and Tray unloading.
Efficiency: 36 PPM
Aged wafer equipment upgrade all control hardware & software and operation system, expand data connectivity for industrial 4.0.
●Dicing Machine
●Slicing Machine
●Grinding Machine
●Scribing Machine
●Wafer size inspection equipment
Wafer equipments integrated in an auto line under one control center, all working process could be monitored on one page.
Wafer lines:
●Wafer Grinding auto line
●Wafer Developer auto line
●Wafer Dicing auto line
●Wafer Stepper Auto line
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