Main Inspection Items
Missing green adhesive tape: No tape at all (critical defect; direct‑short‑circuit risk) Green adhesive tape offset (X/Y‑direction misalignment): Left‑right or up‑down position out of tolerance Insufficient coverage (exposed metal): The green adhesive tape fails to fully cover the tab welding marks; exposed copper / aluminum foil Edge‑lifting, wrinkling and air bubbles on green adhesive tape Green adhesive tape over boundary (over‑application) Tape damage, broken tape, re‑applied tape (double‑layer tape) Dimensional measurement: Tape width, tab protruding distance, clearance dimension
This system enables real-time image acquisition and processing of embossed anode/cathode sheet bumps, allowing for real-time bump height measurement and judgment. It performs green tape avoidance dimension measurement & inspection, identifies the presence of green tape on embossed areas, and supports online calibration and point-check functions.
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