This is the fully automatic semiconductor probe assembly and test equipment. It features ultra high precision in assembly process and the intelligent inspection of the finished products. This product is one of the most technologically advanced equipment by international standards in this industry, and has been exported to Northern America.
Key Features:
Read more >● Assembly Precision：15um
● UPH:720
● Visual Inspection included
● Spring Force Test
Semi-automatic semiconductor probe assembly equipment
Features:
● Ultra high assembly precision: 15um
● Visual Inspection included
● Spring force test included
● UPH: 500
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BOSA Module Auto Assembly Machine
Key Features:
Compatible with pigtailed and pluggable BOSA module
Visual image parameter collection, detection, classification, recording functions included
Real time track and trace databased process parameter
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